>PRODUCT>IT&T PRODUCT
INQUIRY |
|
---|
It will be able to satisfy the needs of various types of SOC products and also can construct instruments that are customer specialized through the application of open architecture. | |
---|---|
- Test Device | AP, DDI, PMIC, SSD CONTROLLER, SMART IC |
- Channel | 4,096 (IO) |
- Speed | Up to 800Mbps |
- Dimension | Power Unit : 800 x 835 x 2300, Test Header : 790 x 1350 x 990 |
- Operating System | Windows / Linux |
It will be able to satisfy the needs of various types of SOC products and can also construct instruments that are customer specialized through the application of open architecture. | |
---|---|
- Test Device | AP, DDI, PMIC, SSD CONTROLLER, SMART IC |
- Channel | 1,024 (IO) |
- Speed | Up to 800Mbps |
- Dimension | Power Unit : 800 x 835 x 2300, Test Header : 800 x 1300 x 875 |
- Operating System | Windows / Linux |
It is NAND FLASH Test equipment with high speed | |
---|---|
- Test Device | FLASH(Optimized for NAND FLASH), DRAM, eMMC, MCP |
- Parallelism | Up to 640Para |
- Speed | Up to 1.6Gbps (TBD 2.4Gbps) |
- Temperature | -40℃ ~ 125℃ |
- Dimension | 2500 x 1850 x 2100 |
- Operating System | Windows10 64bits |
This is one of the equipments that can be BIST-tested by a continuous array of SSD products through the UART interface. It will be able to test M.2, U.2, E1.S, E3.S, SATA, and SAS products independently from Formfactor. | |
---|---|
- Test Device | SSD |
- Parallelism | 2,400 (per Handler) |
- Temperature | 25℃ ~ 60℃ |
- Dimension | Handler : 3030 x 1600 x 2630, Loader : 2040 x 1580 x 1920, UnLoader : 2040 x 980 x 1950 |
- Operating System | Windows / Linux |
It can test all types of memory products. It is very small in size and suitable for laboratory applications and can be expanded indefinitely. It is available for DC & Gross Function defect detection purposes before Burn-in Test and is suitable for memory DIE pre-defect detection before manufacturing composite chips | |
---|---|
- Test Device | DRAM, NAND Flash, LPDDR, eMMC, UFS, HBM |
- Parallelism | Up to 16Para |
- Speed | Up to 400Mbps |
- Dimension | 450 x 700 x 195 |
- Operating System | Windows / Linux |
It can test all types of memory products. It is very small in size and suitable for laboratory applications and can be expanded indefinitely. It is available for DC & Gross Function defect detection purposes before Burn-in Test and is suitable for memory DIE pre-defect detection before manufacturing composite chips. | |
---|---|
- Test Device | DRAM, NAND Flash, LPDDR, eMMC, UFS, HBM |
- Parallelism | Up to 8Para |
- Speed | Up to 800Mbps |
- Dimension | 560 x 600 x 195 |
- Operating System | Windows / Linux |
NEOS2-based extension product.Equipment that increases test reliability by supporting the Source SYNC method. | |
---|---|
- Test Device | DRAM, NAND Flash, LPDDR, eMMC, UFS, HBM |
- Parallelism | Up to 24Para |
- Speed | Up to 800Mbps |
- Dimension | 1075 x 1345 x 950 |
- Operating System | Windows / Linux |
NEOS2-based extension product. Equipment that increases test reliability and improves mass production by supporting the Source SYNC method. | |
---|---|
- Test Device | DRAM, NAND Flash, LPDDR, eMMC, UFS, HBM |
- Parallelism | Up to 128Para (4-Share) |
- Speed | Up to 400Mbps |
- Dimension | 1500 x 1240 x 1000 |
- Operating System | Windows / Linux |
NEOS2-based extension product. Equipment that increases test reliability and improves mass production by supporting the Source SYNC method. | |
---|---|
- Test Device | DRAM, NAND Flash, LPDDR, eMMC, UFS, HBM |
- Parallelism | Up to 512Para (8-Share) |
- Speed | Up to 200Mbps |
- Dimension | 910 x 900 x 1995 |
- Operating System | Windows / Linux |
Neos3 is equipment that has extensive test-capacity to be able to test between the core-test and mid-band test. Also, it can combine with the customer's test mode for merging the speed test. | |
---|---|
- Test Device | NAND, DRAM, LPDDR, HBM, UFS |
- Parallelism | |
- Speed | |
- Dimension | |
- Operating System |
TBD | |
---|---|
- Test Device | |
- Parallelism | |
- Speed | |
- Dimension | |
- Operating System |
To detect potential defects in the device product in the early stage, this device is tested by applying thermal stress to the device at high temperatures and low temperatures (-40°C to 125°C). This is a burn-in test equipment that performs over stress with temperature, current, and voltage for a long time by applying electrical conditions, such as voltage, current, etc., which are higher than actual use conditions to improve reliability when the device is used. It also supports the CON-CURRENT TEST function, which simultaneously tests the LPDDRx of eMCP with eMMC. | |
---|---|
- Test Device | FLASH(Optimized for NAND FLASH), DRAM, eMMC, MCP |
- Parallelism | Up to 768Para |
- Speed | Up to 1.6Gbps |
- Temperature | -40℃ ~ 125℃ |
- Dimension | 1390 x 1700 x 2550 |
- Operating System | Windows / Linux |
This is one of the equipments that can be BIST- Test, by SSD products through the UART interface. It supports BIB for the type of M.2, E1.S and E3.S and it can logistics automation process. | |
---|---|
- Test Device | SSD |
- Parallelism | 2,400 |
- Temperature | 35℃ ~ 85℃ |
- Dimension | Chamber : 3260 x 2400 x 2480 |
- Operating System | Linux |