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INQUIRY
  • TEL : 070-5014-1353
  • E-MAIL : jhkoo@it-t.co.kr
이전제품
  • BOST
  • Memory Test System - Neos2
  • Memory Test System - Neos3
  • SOC Test System - JH200
  • Memory Module Tester - IM9600
  • DC & FUNTION TESTER - NEOS1
  • Memory Burn-in Test System - B3000
  • Memory Burn-in Test System - JH5300
  • Memory Burn-in Test System - JH5400
  • SSD In-Line Test System - SV3.X
다음제품
  • BOST
  • BOST

    상세설명
    제품개요
    BOST(Built Off Self Test) enhances performance and specifications of the existing equipment through BOST instead of Hi-Fix of the existing ATE equipment, and it provides to be an ideal solution to maximize productivity by realizing a doubling of ATE Original Test Speed and expanding the number of parallel test parameters by 8 times to maximize.
    제품특징
    - Target System : T5581, T5585, T5377, T5375, T5593
    - Target Device : DDR1,2,3, LPDDR1,2,3, FLASH MEMORY
    - Frequency : The doubling of frequency Target System original Spec
    - Pararllel Test : Realization of increasing Parallel Test Target System original Spec by 4 times up to 8 times
  • Memory Test System - Neos2
  • Memory Test System - Neos2

    상세설명
    제품개요
    Neos2 is equipment that has been developed to provide flexible test solutions to various devices, it also aims to make a low-cost tests for productivity improvement.
    제품특징
    - Target Device : NAND, eMMC, DDR3/4, LPDDR3/4
    - Frequency : Up to 800Mbps (With TOF)
    - Power Channel : -1V ~ 4V, 1.2A, Up to 1024 Channel
    - Parallel Test : 512Para
  • Memory Test System - Neos3
  • Memory Test System - Neos3

    상세설명
    제품개요
    Neos3 is equipment that has extensive test-capacity to be able to test between the core-test and mid-band test. Also it has the ability to combine with the customers test mode for merging the speed-test.
    제품특징
    - Target Device : DDR3/4, LPDDR3/4, Flash (eMMC, NAND)
    - Frequency : Up to 2133Mbps
    - Power Channel : -1V ~ 4V, 1.2A, Up to 1024 Channel
    - Parallel Test : 384Para
  • SOC Test System - JH200
  • SOC Test System - JH200

    상세설명
    제품개요
    It will be able to satisfy the needs of various types of SOC products and can also construct instruments that are customer specialized through the application of open-architecture.
    제품특징
    - Target Device : SOC (AP , DDI , Smart-IC etc)
    - Frequency : 200MHz
    - Slot : up to 26 Slot
  • Memory Module Tester - IM9600
  • Memory Module Tester - IM9600

    상세설명
    제품개요
    A type of High Speed mounting (Mother Board Base) used as Memory Module Tester, based on automatic Module-Handler which is be able to improve productivity.
    제품특징
    - Target Device : UDIMM, R-DIMM, FB-DIMM etc
    - Frequency : 3.2Gbps (Depend On MBD Spec)
    - Parallel Test : 12Para/Head (Depend On MBD Spec)
  • DC & FUNTION TESTER - NEOS1
  • DC & FUNTION TESTER - NEOS1

    상세설명
    제품개요
    메모리 전제품 테스트가 가능한다. 최소 단위가 매우작은 사이즈로 실험실 용도에 적합하며 또한 무한 확장이 가능하므로 대량 양산환경 역시 적합한다. 특징적으로는 번인 소타에 연결하여 번인전 DC & Gross Function 불량 검출목적에 사용되어질수 있다. 또한 FOWLP등 복합칩 제조전 메모리 DIE의 사전 불량 검출용도에도 적합한 기능을 가지고 있다.
    제품특징
    - Target Device: DRAM, NAND Flash, Mobile Dram, eMMC, UFS, HBM
    - Frequency: Up to 200MHz
    - Parallel Test: Up to 16Para
  • Memory Burn-in Test System - B3000
  • Memory Burn-in Test System - B3000

    상세설명
    제품개요
    Memory type of product for QC/QA as engineering Burn-In Tester.
    제품특징
    - Target Device : Flash (NAND, eMMC, SPI NAND etc) , DRAM
    - Frequency : 20MHz
    - Temperature : RT(Room Temp.) ~ +150℃
    - Slot : 4 Slot
  • Memory Burn-in Test System - JH5300
  • Memory Burn-in Test System - JH5300

    상세설명
    제품개요
    The applied specialized function of flash memory, in the memory burn equipment, is to satisfy the customers varied demands in order to reduce tests times and maximize the mass production.
    제품특징
    - Target Device : Flash (NAND, eMMC, SPI NAND etc) , DRAM
    - Frequency : 20MHz
    - Temperature : -10 ~ +150℃
    - Slot : up to 60 Slot
  • Memory Burn-in Test System - JH5400
  • Memory Burn-in Test System - JH5400

    상세설명
    제품개요
    JH5400은 Device제품의 잠재적인 불량을 초기에 발견하기 위하여 제품에 고온&저온(-40℃ ~ 125℃)으로 Device에 열적 Stress를 인가하여 Test하는 것 이며, Device가 실제 사용할 때 사용 가능 하도록 신뢰성(Reliability)을 높여주기 위해 실제 사용 조건 보다 높은 전압, 전류 등의 전기적 Stress를 가하여 장시간 온도, 전류, 전압으로 Over Stress를 행하는 Burn-in Test 설비이다. 특징적으로는 TERABIT급이상 대용량 UFS(universal flash storage) 및 ONFI NAND FLASH MEMORY의 불량검출에 적합하게 사용되어질수 있다. 또한 eMMC를 포함하는 eMCP의 LPDDRx와 동시에 TEST하는 CON-CURRENT TEST기능도 지원한다.
    제품특징
    - Target Device : Flash, TBD(Dram, eMMC , MCP)
    - Frequency : 400MHz
    - Temperature : -40.0 ~ +150.0℃
    - Slot : 8 Slots
  • SSD In-Line Test System - SV3.X
  • SSD In-Line Test System - SV3.X

    상세설명
    제품개요
    This is one of equipment that can be BIST-tested by a continuous array of SSD products through the UART interface. It will be able to test M.2, U.2, SATA, SAS products independently from Formfactor.
    제품특징
    - LOAD/UNLOAD : Operating automation by the MAGAZINE as an unit
    - HANDLER : Contacting a continuous-array product to the TESTER
    - TEMP : Comprising of a Hot Chamber ( 1HD 6Chamber )
    - Transport : MANUAL , SEMI AUTO, OHT